{"id":6055,"date":"2026-10-31T19:03:19","date_gmt":"2026-10-31T11:03:19","guid":{"rendered":"https:\/\/www.hongqiaotechweek.com\/?p=6055"},"modified":"2026-10-31T19:03:19","modified_gmt":"2026-10-31T11:03:19","slug":"what-is-at-stake-in-the-global-compute-race-top-tech-experts-to-debate-at-hongqiao-international-science-and-technology-week","status":"publish","type":"post","link":"https:\/\/www.hongqiaotechweek.com\/en\/what-is-at-stake-in-the-global-compute-race-top-tech-experts-to-debate-at-hongqiao-international-science-and-technology-week\/","title":{"rendered":"What Is at Stake in the Global Compute Race? Top Tech Experts to Debate at Hongqiao International Science and Technology Week"},"content":{"rendered":"
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On October 21, NVIDIA released the DSX POD modular AI factory reference design. It integrates computing, networking, power supply and liquid cooling at the factory stage, offering a new practical perspective on compute infrastructure deployment: beyond chips, interconnection, power delivery, thermal management and delivery jointly determine how projects come to fruition.<\/p>\n

From November 20 to 22, 2026, the Smart Infrastructure Stage of Hongqiao International Science and Technology Week will take place at the National Exhibition and Convention Center (Shanghai). Focusing on critical pillars of AI infrastructure development, it covers global compute deployment, network interconnection, energy management, construction & operation, and security applications.<\/p>\n<\/section>\n<\/section>\n<\/section>\n

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Hongqiao International Science and Technology Week \u23f0 Nov 20\u201322, 2026 \ud83d\udccd National Exhibition and Convention Center (Shanghai)<\/p>\n

Scan the QR code to purchase your Conference Pass Access all six themed forums with one single pass Meet industry experts face-to-face!<\/p>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n

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The rollout of AI infrastructure depends on regional demand as well as connectivity conditions. Who will build the next\u2011generation digital backbone, and how submarine cables and satellite communications evolve, will shape which markets computing power can serve.<\/p>\n

Futurist Professor Rocky SCOPELLITI opens the discussion on global network development with the question of who will build the world\u2019s next\u2011generation digital backbone. Despina Panayiotou THEODOSIOU, CEO of Tototheo Global, further expands the conversation around submarine cables, satellites and the future of global connectivity, exploring the evolution of different connection technologies.<\/p>\n

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Real shot of server cabinets at Jakarta JK1 Data Center | Source: Equinix official website<\/p>\n

For enterprises seeking overseas growth opportunities, Indonesia is a noteworthy market in this agenda. Erick HADI, Secretary-General of the Indonesia Data Center Ecosystem Council, will share insights on the data center boom in Indonesia, shifting the discussion from global networks to tangible regional opportunities.<\/p>\n

Beyond market opportunities, investment and global expansion economics also need careful evaluation. \u201cFrom GPUs to Green Power: What is Capital Betting on in the AIDC Track?\u201d is the question raised by Chen Jun, Founder and CEO of Shishi Capital. Wu Xianping, former lead for Shell joint venture project delivery, will present the topic When AI Starts to Consume Massive Power: What is the Next Move for Chinese Companies Expanding Overseas?<\/em>, linking cross-border expansion to AI power consumption demand.<\/p>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n

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High-density AI workloads impose stricter requirements on power supply and thermal management. How power supplies, energy storage systems, UPS and cooling solutions work in coordination has therefore become a core challenge in construction and operation.<\/p>\n

Compute-power synergy runs through multiple sessions in this track. Yang Haiming, CTO of China Unicom Digital Technology, and Zhang Di, President of the AIDC Division at Sungrow, will offer perspectives from telecom operators and energy enterprises respectively. Kang Kai, Head of the Product Center in the AIDC Division at Trina Solar, focuses on the integrated restructuring of computing power and energy.<\/p>\n

High-density workloads rely on tailored power supply solutions. He Zhaoxiao, APAC Internet Industry General Manager of the AIDC Division at Sinexcel, will discuss architecture selections, load fluctuation and power quality issues across different markets.<\/p>\n

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Example of CPO switching system hardware | Source: NVIDIA Developer, August 2025<\/p>\n

The application of energy storage is also advancing. How supercapacitors empower AIDCs and new power systems will be the focus of the presentation by Li Weidong, CTO of Jinzhao Times. From backup power assurance to energy operation, Zhu Hua, CTO of Wanwu Funeng (Shenzhen) Technology Co., Ltd., will discuss integrated standby power technologies and their applications for AI data centers.<\/p>\n

Besides power supply, effective heat removal is critical for the operation of high-density computing power. Wang Yuyu, Senior Strategic Marketing Specialist for APAC at Sortant, will focus on the application of HFO refrigerants in data center chillers and next\u2011generation two\u2011phase cold plate liquid cooling technology, bridging rack cooling and on-chip thermal management.<\/p>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n

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Beyond power and thermal management, networking is another integral factor to be considered alongside compute infrastructure deployment.<\/p>\n

Three analysts from Omdia (Informa TechTarget) will deliver insights covering construction trends, operator strategies and optical interconnect technologies. Tang Tao, CTO of VNET Blue Cloud, will discuss global technologies, localised operations and trusted delivery, focusing on the compute foundation required for enterprise digital and intelligent transformation. Modular deployment represents another approach in infrastructure build-out. Li Zhen, CEO of Shenzhen Fulosen Technology Co., Ltd., will share modular compute centre infrastructure solutions and case studies to illustrate practical construction and delivery practices.<\/p>\n<\/section>\n<\/section>\n<\/section>\n

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Close-up rendering of liquid-cooling CDU and cabinet piping | Source: Vertiv official website<\/p>\n

After delivery, the role of data centers is also evolving. Yang Bo, General Manager of Anhui Runxun Data, Longyu Data Group, will discuss the compute foundation in the AI era from the perspective of the shift from “digital warehouses” to “compute factories”. This transformation also extends to cloud services. Feng Zhenwang, Founder and CEO of NewTitan Cloud Services, will explore how AI drives the transformation of Cloud MSPs, expanding the discussion from infrastructure to enterprise-focused cloud management services.<\/p>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n

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Once computing resources and services are ready, enterprises still need to address practical questions: how to protect data, manage risks associated with models and applications, and allocate responsibilities among different stakeholders.<\/p>\n

Tan Xiaosheng, Founder and Chairman of Beijing Cyberying Technology Co., Ltd., will analyse trends in China\u2019s cybersecurity market for 2026. Aligned with these market insights, Shen Yong, Co-Chair of the Shanghai Chapter, CSA Greater China, will present Fighting AI with AI: Security Management Practices in the AI Era<\/em>, grounding the discussion in real-world security operations.<\/p>\n<\/section>\n<\/section>\n<\/section>\n

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Schematic of AI security technologies | Source: NVIDIA Official Blog<\/p>\n

Mantas MAZEIKIS, CISO of HELM AG, will share how enterprises move from experimental trials to secure production deployment. Alex CHI, Chief Digital & Information Officer of SP Setia in Malaysia, will present Architecting the Future: Digital Systems for 2035<\/em>, linking current technology rollout to future digital architectures. This session will be moderated by Derrick LOI, Board Member of Ronald McDonald House Charities Singapore.<\/p>\n

More on-site case studies and technical insights November 20\u201322 National Exhibition and Convention Center (Shanghai)<\/p>\n

See you at Hongqiao International Science and Technology Week! Full agenda below \u2b07\ufe0f<\/p>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n

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If you are advancing compute infrastructure projects, network upgrades, energy solutions or enterprise AI applications, you are welcome to join Hongqiao International Science and Technology Week to exchange solutions, case studies and project experience with experts and practitioners in relevant fields.<\/p>\n

Scan the QR code to purchase your Conference Pass. Access all six themed forums with one pass.<\/p>\n

Conference Pass<\/strong> \u25bc Gain in-depth access to concurrent sessions, engage face-to-face with industry experts and stay ahead of cutting-edge trends.<\/p>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n

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Price: \u00a51,088 Standard Rate<\/p>\n

Benefits<\/strong><\/p>\n

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  • Access to all exhibition halls and interactive experiences at Hongqiao International Science and Technology Week<\/li>\n
  • Admission to all parallel breakout sessions and keynotes from world-renowned speakers (excluding the Global Leaders Summit)<\/li>\n
  • Access to forum materials<\/li>\n
  • Access to the Inspire Chat Room to start or join topic discussions<\/li>\n
  • On-site one-on-one targeted business matchmaking service<\/li>\n<\/ul>\n

    Bring your colleagues to attend all six themed forums and bring cutting-edge insights back to your team! Group discount of up to 30% off for groups of 3 or more purchasing Conference Passes. Contact our WeChat mini-program assistant for one-stop registration support!<\/p>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n<\/section>\n

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    \"\"<\/section>\n<\/section>\n<\/div>\n","protected":false},"excerpt":{"rendered":"

    On October 21, NVIDIA released the DSX POD modular AI factory reference design. It integrates computing, networking, power supply and liquid cooling at the factory stage, offering a new practical perspective on compute infrastructure deployment: beyond chips, interconnection, power delivery, thermal management and delivery jointly determine how projects come to fruition. From November 20 to […]<\/p>\n","protected":false},"author":6,"featured_media":6056,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[23],"tags":[],"class_list":["post-6055","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-event-news-press-releases"],"yoast_head":"\nWhat Is at Stake in the Global Compute Race? 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