Paul Duan holds a master’s degree in Microelectronics and Solid-State Electronics from Jilin University and is currently Chairman and CEO of Xinfangzhou (Shanghai) Integrated Circuit Co., Ltd. He has extensive experience in chip R&D, technical management, and commercialization. He previously worked at Renesas Semiconductor, AMD, General Purpose Chip and Basic Software Research Center, Chinese Academy of Sciences‌, Xinmeng Technology, and China FAW,where he participated in and led the development and mass production of dozens of GPUs and APUs. He was responsible for tackling key technical challenges in the development of proprietary X86 CPU cores and led projects for Level 4 autonomous driving chips, AI processors, and 3D high-bandwidth memory chips. He spearheaded the world’s first 3D-stacked, noncache AI accelerator chip, which was successfully shipped, with related research results published twice by IEEE.